Edge AI Rugged Computer
ABOX-5221(P)(G) LC Series

ABOX-5221 ThermoSiphon™ Liquid-Cooled Rugged Edge AI Computer

  • ThermoSiphon™ Cooling: Patented pump-less, fanless loop delivering 3x to 5x higher thermal efficiency than passive blocks, providing 0 dBA acoustic and IR stealth.
  • 682 AI TOPS Power: Sustains 100% workloads for Intel® Core™ 14th Gen CPUs and NVIDIA RTX™ Ada GPUs from -40°C to 70°C inside an IP-rated sealed chassis.
  • 10-Min Internal BBU: Patented built-in battery prevents data loss during vehicle brownouts without adding external UPS bulk.
  • Modular Open Architecture: Swappable MXM GPU and M.2 slots for fast eld scaling; optimized for NVIDIA RTX AI Toolkit and Intel® OpenVINO™.
  • Dual 10GbE Pipelines: Redundant high-bandwidth lanes with M12 connectors for sensor fusion; fully MIL-STD-810H and IEC 62443 compliant.

Product Status: Sample Available
Conformité Européenne FCC Certification E-Mark Certification EN 50155 Wide voltage Wide temperature Fanless
SYSTEM
Processor

• Intel® Core™ (14th gen) i9-14900T 24C/32T processor
• Intel® Core™ (14th gen) i7-14700T 20C/28T processor
• Intel® Core™ (14th gen) i5-14500T 14C/20T processor

Graphics

• Processor-integrated GPU –

Intel® UHD Graphics 770

• Optional discrete GPU –

NVIDIA RTX™ Embedded 2000 Ada / 3500 Ada / 5000 Ada

Intel® Arc™ A370E

Chipset

• R680E

Memory

• 2 x DDR5-5600 SO-DIMM up to 96GB
(ECC support with ECC DRAM)

Security

• TPM 2.0, dTPM

Watchdog

• Auto reset for unresponsive system
(custom 1-255 sec/min settings in BIOS)

INTERFACE
Video

• Without discrete GPU –

2 x HDMI® up to 3840 x 2160 @ 60Hz as specied in HDMI 2.0b

• With discrete GPU –

Additional 2 x DP++ up to 7680 x 4320 @ 60Hz

Audio

• 1 x Line-out, 1 x Line-in, 1 x Mic-in

Ethernet

• 2 x 10GbE (Marvell AQC113) via RJ-45 (optional M12 X-code)
• 4 x 2.5GbE (Intel I226) via RJ-45 (optional PoE+ and M12 X-code)
* ETH3 supports Intel® AMT
** All Ethernet ports support PXE boot and Wake-on-LAN
*** PoE supports 25.5W per port with total power budget: 120W

USB

• 8 x USB 3.2 Gen 2

DIO

• 8 x DI (DC 5-60V), 8 x DO (DC 5V/100mA)

COM

• 2 × RS-232/422/485

INTERNAL EXPANSION

M.2

• 1 x M.2 3042/3052 Key B for WWAN with dual SIM support

• 1 x M.2 2230 Key E for Wi-Fi/BT

* Thermal solution is required for M.2 5G module

Mini PCIe

• 2 x Mini PCIe (full-size)

STORAGE
Storage Type

• 1 x M.2 2280 Key M for NVMe/SATA SSD
• 2 x M.2 2280 Key M for NVMe SSD
• 2 x Removable tray for 2.5″ SATA SSD
* RAID 0/1/5 support via Intel® VMD.

POWER
Power Input

• DC 9-60V input (nominal power input DC 12V/24V/48V) via 5-pin terminal block
* Nominal power input of DC 24V or above is required for system with discrete GPU and PoE

Power Protection

• OCP, OVP, surge protection, reversed polarity protection

Power Management

• Ignition detection, Smart Power Management

RTC Battery

• Front removeable tray for RTC coin cell battery

Battey Backup Unit (BBU)

• Optional battery kit for up to 10 minutes emergency backup time
(Battery charging Temp. 0°C~45°C and discharging Temp. -10°C~60°C)
* BBU backup time varies depending on actual overall system power consumption
and battery is required to be charged before being used for system power backup
** Operating temperature will be limited within -10°C and 60°C with the battery kit installed.
Patent No.: M447854 (Built-in battery)

SOFTWARE
Operating System

• Windows 11 IoT Enterprise LTSC
• Ubuntu 22.04 LTS

ENVIRONMENTAL
Operating Temp.

• -40°C ~ 70°C (-40°F ~ 158°F) with 0.6 m/s airflow
* Operating temperature varies by accessories installed.

Storage Temp.

• -40°C ~ 85°C (-40°F ~ 176°F)

Relative Humidity

• 10% RH ~ 90% RH (non-condensing)

Vibration

• IEC 60068-2-64, random, 2.5G (Z) 0.21G (Y) 0.76 (Z)@5~500Hz, 1hr/axis
• MIL-STD-810H, Method 514.8, Category 4
• EN 61373:2010, Clause 8

Shock

• MIL-STD-810H, Method 516.8, 20G (11ms)
• EN 61373:2010, Clause 10

CERTIFICATION / COMPLIANCE

• CE, FCC Class A, UKCA, E-Mark, EN 50155, EN 45545-2 (R25), IEC 62368-1

MECHANICAL
Construction

• Aluminum Alloy

Antenna

• 7 x SMA connector mounting hole

Mounting

• Wall mounting

Net Weight

• 5.70 kg (12.57 lb)

Dimensions (L x W x H)

• 290 x 250 x 98 mm (11.42 x 9.84 x 3.86 in.) with mounting brackets

Ingress Protection

• IP40

ORDERING INFORMATION
Model Number

ABOX-5221(P)(G)(-M12X)-zz (P= w/ PoE, G=w/ Discrete GPU, M12X=w/ M12 X-coded connectors,
zz=i9=i9-14900T, zz=i7=i7-14700T, zz=i5=i5-14500T

Description

Intel® Core™ Processors (14th Gen) with Discrete GPU Options and High-Bandwidth 10GbE Edge AI Computer

State of Origin

Made in Taiwan

OPTIONAL ACCESSORIES
Memory

DDR5-5600 SO-DIMM, 8GB to 48GB, -40°C ~ 85°C (ECC option available)

Storage

M.2 2280 Key M NVMe SSD w/ thermal kit, -40°C ~ 85°C
M.2 2280 Key B-M SATA SSD w/ thermal kit, -40°C ~ 85°C
2.5″ SATA SSD, -40°C ~ 85°C

Wi-Fi

M.2 2230 Key A-E Wi-Fi module, -40°C ~ 85°C

WWAN

M.2 3042/3052 Key B WWAN module w/ thermal kit, -40°C ~ 85°C

GNSS

M.2 2242 Key B GNSS module, -40°C ~ 85°C
Mini PCIe GNSS module, -40°C ~ 85°C

CAN Bus

Mini PCIe CAN module, -40°C ~ 85°C

Battery (BBU)

BAT-5200 battery kit, charging Temp. 0°C ~ 45°C, discharging Temp. -10°C ~ 60°C

Power Adapter

AC/DC 100-240V/24V 280W C14 bare wire power adapter

OPTIONAL DISCRETE GPU

Discrete GPU NVIDIA RTX™ Embedded 5000 Ada Generation NVIDIA RTX™ Embedded 3500 Ada Generation NVIDIA RTX™ Embedded 2000 Ada Generation Intel® Arc™ A370E
Graphic Cores 9728 CUDA / 304 Tensor 5120 CUDA / 160 Tensor 3072 CUDA / 96 Tensor 8 Xᵉ-cores / 128 Execution Units
Memory Type/Size GDDR6 16GB GDDR6 12GB GDDR6 8GB GDDR6 4GB
AI TOPS* 682 369 232 56
System Operating Temp. 0°C ~ 60°C 0°C ~ 60°C 0°C ~ 70°C 0°C ~ 70°C
*AI TOPS Precision - FP8 for NVIDIA RTX™ Embedded Ada Generation, INT8 for Intel® Arc™.
Processing